Products
Search, filter and compare our products

Toray MicroPly™ TC248SF
Toray MicroPly™ TC248SF is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly™ SC8020A
MicroPly SC8020A low-density unsupported epoxy syntactic core. SC8020A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin walled composite sandwich structures

Toray MicroPly™ RS-15H
Toray MicroPly™ RS-15H is an epoxy film adhesive highly flexible with respect to processing. It is compatible with the Toray RS-1 family of prepregs, with all types of reinforcements and cores. It is also suitable for secondary bonding.

Toray MicroPly™ ES72A-2
MicroPly™ ES72A-2 low-density, expanding, unsupported, epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts / fastenings and, the opportunity to consider lightweight, thin walled composite sandwich structures.

Toray MicroPly™ EM-3
Toray MicroPly™ EM-3 is a 121°C (250°F) curing expanding epoxy film of controlled thickness, based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.

Toray MicroPly™ EF8020
Toray MicroPly™ EF8020 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF8020 is compatible for co-cure with Toray’s 8020 prepreg and SC8020 syntactic core.

Toray MicroPly™ EF72
Toray MicroPly™ EF72 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF72 is compatible for co-cure with many of Toray’s E700 series prepregs that cure at 120°C.

Toray AmberTool® HX42
Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

TC522 New
Toray TC522 is a highly toughened modified epoxy resin system. TC522 displays outstanding Compression After Impact (CAI), setting it apart from other resins designed for dielectric applications.
TC380 New
TC380 is a toughened epoxy prepreg, balanced with excellent OHC, OHT, CAI, and GIC/GIIC properties, low moisture absorption and outstanding hot/wet retention. TC380 is optimized to facilitate the construction of large or complex composite assemblies.
TC346 New
Toray TC346 is a high temperature epoxy component prepreg developed for structural applications within Formula 1 and high performance automotive.
TC275-1E New
TC275-1E is a dual cure toughened epoxy prepreg designed to facilitate a thick or larger composite part construction with low pressure or vacuum pressure cures. The resin system features a 28 day total out time.
TC264-1
TC264-1 is a flame-retardant epoxy prepreg developed for oven-cure fabrication composite processes utilizing expendable or reusable lay-up mandrels. TC264-1 is ideal for use in applications such as ducting, decorative enclosures and panel assemblies.

RS-50
RS-50 is a toughened low viscosity epoxy RTM resin which can be used in wet winding, RTM and VARTM processing. RS-50 has a long four hour pot life.

MS-4H
MS-4H is carbon fiber / epoxy resin compression molding system using high strength, standard modulus (HS) carbon fiber. MS-4H is an excellent low cost, high performance BMC and processes very well in medium to large heavy parts.

MS-1H
MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.
EX-1522
EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.
E760
E760 is a highly toughened epoxy component prepreg with exceptional high temperature performance. E760 has been designed for use in mechanically demanding structural applications exposed to elevated temperature environments e.g. Formula 1.
E745
E745 is a 135°C (275°F) cure toughened epoxy component prepreg. E745 has been developed for impact structures and other mechanically demanding structural applications. E745 can be impregnated into a range of fiber and fabric types.
E731
E731 is a toughened epoxy component prepreg designed to deliver enhanced resin clarity for cosmetic components within high performance automotive. The E731 resin formulation ensures that components are free from white-spots and exhibit high clarity.
E721-FR
E721-FR is a 120°C (248°F) cure modified epoxy prepreg of medium viscosity. E721-FR offers excellent structural properties, flame retardancy and exceptional toughness allowing direct lamination to honeycomb without the use of a film adhesive.
- 1
- 2
Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.

Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.
.jpg?w=40&h=40&action=crop)