Products

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC235SF-1 is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

Toray MicroPly™ RS-4A is a cyanate ester based film adhesive developed to provide good adhesive performance for core / face skin structures, co-curing and secondary bonding.

Toray MicroPly™ EX-1543 cyanate ester film adhesive formulated for low moisture absorption and/or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures at high temperatures.

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray Cetex® TC915 is a thermoplastic composite using a high-performance polyamide matrix resin. This product provides exceptional mechanical properties higher than typical polyamide-based composites and Nylon materials.

Toray Cetex® TC1225 is a high-end thermoplastic composite material, utilizing a semi-crystalline low-melt polyarlyetherketone resin with excellent mechanical performance and lower processing temperatures.

Toray Cetex® TC1000 Design is a cost-effective, high-end thermoplastic composite, utilizing the amorphous PEI polymer for outstanding toughness and an inherently outstanding fire, smoke, and toxicity performance (< 15/15 OSU).

Toray Cetex® MC1200 PEEK is a thermoplastic BMC based upon TC1200 UD tape using high strength fibers in lengths of up to 25.4mm (1"). MC1200 allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray AmberTool® HX56 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180ºC (356ºF) is achieved. Toray AmberTool® HX56 achieves an excellent surface finish for small to medium sized autoclave tooling.

TC890 is a very high temperature polyimide prepreg utilizing PROOF 900HT resin system. It has a service temperature capability up to 427°C (800°F). It displays exceptional toughness, superb low dielectric loss properties and is thermally stable.

Toray TC522 is a highly toughened modified epoxy resin system. TC522 displays outstanding Compression After Impact (CAI), setting it apart from other resins designed for dielectric applications.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

TC264-1 is a flame-retardant epoxy prepreg developed for oven-cure fabrication composite processes utilizing expendable or reusable lay-up mandrels. TC264-1 is ideal for use in applications such as ducting, decorative enclosures and panel assemblies.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.

RS-50 is a toughened low viscosity epoxy RTM resin which can be used in wet winding, RTM and VARTM processing. RS-50 has a long four hour pot life.

RS-36 is an advanced modified epoxy prepreg for structural composite applications. RS-36 offers an excellent balance of mechanical properties, low moisture absorption and a range of processing options. For a higher Tg, RS-36-1 is available

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

ANA aerospace grade Nomex® honeycomb core is manufactured from Nomex® paper sheets, coated and bonded together with a phenolic resin. It offers high strength to weight properties at relatively low cost and, FST performance where required.

MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.

E750 is a toughened epoxy component prepreg developed for structural applications within Formula 1 and high performance automotive. E750 allows curing from 80°C (176°F) to 180°C (356°F) and can be impregnated into a range of fiber and fabric types.

E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural applications in motorsport and marine industries and, a wide range of engineering applications.

Toray’s aluminum commercial grade honeycomb core is manufactured from corrosion-resistant 3003 alloy foil. It offers high strength-to-weight properties at relatively low cost, particularly suitable as a shear carrying core in sandwich panel structures.