Products

Toray MicroPly™ SF-5 is a cyanate ester based syntactic film with compatibility to various cyanate ester matrices, including troray RS-3. It is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils).

Toray MicroPly™ RS-15H is an epoxy film adhesive highly flexible with respect to processing. It is compatible with the Toray RS-1 family of prepregs, with all types of reinforcements and cores. It is also suitable for secondary bonding.

Toray MicroPly™ EM-3 is a 121°C (250°F) curing expanding epoxy film of controlled thickness, based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.

RS-16 is a two-part low viscosity cyanate ester RTM resin for wet winding, RTM and VARTM processing. RS-16 is intended for lower temperature exposure and is an ideal system when used with different materials limiting the upper cure temperature.

Toray’s Nomex® aerospace grade honeycomb core is manufactured from Nomex® paper sheets, coated and bonded together with a phenolic resin. It offers high strength to weight properties at relatively low cost and, FST performance where required.

EX-1545 is a toughened two-part cyanate ester resin with extremely low viscosity at room temperature, allowing RTM to take place with minimal resin heating. This facilitates mold filling time for difficult and / or large RTM’d structures and reduces waste.

EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.

EX-1515 cyanate ester prepreg provides optimal mechanical properties, high radiation resistance, microcracking resistance, low moisture absorption / low outgassing while retaining toughness, a low 244°F (118°C) stress-free temperature and long out time.

BTCy-1A is a toughened cyanate ester prepreg. BTCy-1A’s straight-up, easy processing at 177°C (350°F) under low pressure, reduces curing time and production costs, while the system’s negligible volatile emission upon cure allows low void laminates.