Products

Toray MicroPly™ SF-5 is a cyanate ester based syntactic film with compatibility to various cyanate ester matrices, including troray RS-3. It is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils).

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

MicroPly SC8020A low-density unsupported epoxy syntactic core. SC8020A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin walled composite sandwich structures

Toray MicroPly™ RS-15H is an epoxy film adhesive highly flexible with respect to processing. It is compatible with the Toray RS-1 family of prepregs, with all types of reinforcements and cores. It is also suitable for secondary bonding.

Toray MicroPly™ EM-5A is an expanding cyanate ester syntactic film (core splice). Its' unexpanded density is approximately 0.80 g/cc (50 pcf) and it exhibits an expansion ratio of up to 4 times. It is available in continuous film rolls or in sheet form.

Toray MicroPly™ EM-3 is a 121°C (250°F) curing expanding epoxy film of controlled thickness, based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.

Toray MicroPly™ EF8020 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF8020 is compatible for co-cure with Toray’s 8020 prepreg and SC8020 syntactic core.

Toray MicroPly™ EF72 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF72 is compatible for co-cure with many of Toray’s E700 series prepregs that cure at 120°C.

Toray TC522 is a highly toughened modified epoxy resin system. TC522 displays outstanding Compression After Impact (CAI), setting it apart from other resins designed for dielectric applications.

TC380 is a toughened epoxy prepreg, balanced with excellent OHC, OHT, CAI, and GIC/GIIC properties, low moisture absorption and outstanding hot/wet retention. TC380 is optimized to facilitate the construction of large or complex composite assemblies.

TC275-1E is a dual cure toughened epoxy prepreg designed to facilitate a thick or larger composite part construction with low pressure or vacuum pressure cures. The resin system features a 28 day total out time.

TC264-1 is a flame-retardant epoxy prepreg developed for oven-cure fabrication composite processes utilizing expendable or reusable lay-up mandrels. TC264-1 is ideal for use in applications such as ducting, decorative enclosures and panel assemblies.

RS-3 is a modified cyanate ester prepreg, providing a good balance between toughness and high temperature/wet performance. RS-3 is qualified in satellite, airframe/missile and, radome structures. RS-3C is a controlled flow vacuum bag only cure version.

E721-FR is a 120°C (248°F) cure modified epoxy prepreg of medium viscosity. E721-FR offers excellent structural properties, flame retardancy and exceptional toughness allowing direct lamination to honeycomb without the use of a film adhesive.